Internship – Die-Attach Processes for GaN Power Module Assembly

Short Summary

Internship – Die-Attach Processes for GaN Power Module Assembly is an internship opportunity with Fraunhofer ISE. It is connected to Freiburg; occasional home working and falls under Humanitarian & Development.

Key Details

• Position / opportunity: Internship – Die-Attach Processes for GaN Power Module Assembly
• Organization: Fraunhofer ISE
• Country / coverage: Germany
• Location: Freiburg; occasional home working
• Work arrangement: On-site
• Opportunity type: Internship
• Sector: Humanitarian & Development
• Compensation: Not specified
• Application deadline: Not specified

Description

Fraunhofer ISE is offering Internship – Die-Attach Processes for GaN Power Module Assembly for people interested in humanitarian & development. The opportunity is associated with Freiburg; occasional home working with a on-site work arrangement. Applicants should review the role or assignment details, eligibility requirements, benefits, deadline, and application process before applying.

Responsibilities

• Support assigned project, research, technical, administrative, operational, or communications activities.
• Participate in supervised learning, team meetings, documentation, and practical work connected to Humanitarian & Development.
• Prepare assigned notes, analysis, datasets, briefs, presentations, reports, or other deliverables requested by the host team.

Requirements / Eligibility

• Meet the student, graduate, early-career, or participant eligibility rules for the opportunity.
• Have interest, coursework, training, or experience relevant to Humanitarian & Development.
• Submit the required application materials before the stated deadline and follow the application process.

Benefits / Compensation

• Compensation, benefits, fees, allowances, or volunteer arrangements are not specified.

How To Apply

Use the Apply now button and follow the stated application process.