Sr Staff Package Design Engineer

Short Summary

Sr Staff Package Design Engineer at Renesas Electronics. About the employer Responsibilities Job Summary Senior Staff Package Design Engineer overseas the Backend Semiconductor manufacturing processes and activities at OSATs. Be the primary technical interface between Renesas and OSATs. Note: OSAT – Outsourcing Subcontractor Assembly & Test Key Responsibilities Managing OSAT towards good yield, quality, delivery, cost…

Key Details

• Position / opportunity: Sr Staff Package Design Engineer
• Organization: Renesas Electronics
• Country / coverage: Malaysia
• Location: Bayan Lepas, , Malaysia
• Work arrangement: On-site
• Opportunity type: Jobs
• Sector: Information Technology
• Compensation: Not specified
• Application deadline: Not specified by source

Description

About the employer

Responsibilities

Job Summary

Senior Staff Package Design Engineer overseas the Backend Semiconductor manufacturing processes and activities at OSATs. Be the primary technical interface between Renesas and OSATs.

Note: OSAT – Outsourcing Subcontractor Assembly & Test

Key Responsibilities

Managing OSAT towards good yield, quality, delivery, cost performance and drive improvement activities to meet KPI.

Collaborate with cross-functional teams (NPI, Supply Chain, Quality) on new packages/products, or existing products but alternate supplier/OSAT, or process/materials’ changes with qualification activities & towards seamless release transition to production.

Establish and enforce process standards to ensure consistency and compliance with regulatory requirements.

Work closely with Production, Quality Assurance, and Supply Chain teams to resolve technical issues and drive operational excellence. Lead or participate in root cause analysis and corrective action implementation for process-related issues.

Support internal audit and customer audit, and respond on audit findings

Prefer with automotive products experience

Qualifications

Bachelor’s degree in engineering, Science or equivalent field

Minimum 10 years of experience in Semiconductor Manufacturing & Process Engineering

Experience with Lean manufacturing principles and other continuous improvement methodologies.

Knowledge of Project Management, Six Sigma or AutoCAD software will be good to have

Excellent communication skills and ability to work effectively in cross-functional teams

Self-starter and self-supervising within the expectations of senior management

Additional information

Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.

At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.

Are you ready to join our team and shape the future with us?

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.

Responsibilities

• Senior Staff Package Design Engineer overseas the Backend Semiconductor manufacturing processes and activities at OSATs. Be the primary technical interface between Renesas and OSATs.
• Note: OSAT – Outsourcing Subcontractor Assembly & Test
• Managing OSAT towards good yield, quality, delivery, cost performance and drive improvement activities to meet KPI.
• Collaborate with cross-functional teams (NPI, Supply Chain, Quality) on new packages/products, or existing products but alternate supplier/OSAT, or process/materials’ changes with qualification activities & towards seamless release transition to production.
• Establish and enforce process standards to ensure consistency and compliance with regulatory requirements.
• Work closely with Production, Quality Assurance, and Supply Chain teams to resolve technical issues and drive operational excellence. Lead or participate in root cause analysis and corrective action implementation for process-related issues.
• Support internal audit and customer audit, and respond on audit findings
• Prefer with automotive products experience

Requirements / Eligibility

• Bachelor’s degree in engineering, Science or equivalent field

  Minimum 10 years of experience in Semiconductor Manufacturing & Process Engineering

  Experience with Lean manufacturing principles and other continuous improvement methodologies.

  Knowledge of Project Management, Six Sigma or AutoCAD software will be good to have

  Excellent communication skills and ability to work effectively in cross-functional teams

  Self-starter and self-supervising within the expectations of senior management

How To Apply

Select Apply now to complete the application for this position. Submit the documents requested in the application form.