Dir, Package Design Engineering

Short Summary

Dir, Package Design Engineering with Renesas Electronics. Responsibilities: Responsible for Japan Assembly Engineering (PAE1) and Malysia Assembly Engineering (PAE3) Groups. Work with Package Development Group (NPI). Takeover qualified products from NPI for mass production. Work with Supply Chain Management (SCM). Address Capacity or Material supply issues to secure on time delivery. Work with OSATs and QA to address…

Key Details

• Position / opportunity: Dir, Package Design Engineering
• Organization: Renesas Electronics
• Country / coverage: Taiwan
• Location: Taichung, , Taiwan
• Work arrangement: On-site
• Opportunity type: Tenders / Consultancies
• Sector: Health
• Compensation: Not specified
• Duration: Not specified
• Start date: 2026-07-28
• Application deadline: Not specified

Description

Responsibilities: Responsible for Japan Assembly Engineering (PAE1) and Malysia Assembly Engineering (PAE3) Groups. Work with Package Development Group (NPI). Takeover qualified products from NPI for mass production. Work with Supply Chain Management (SCM). Address Capacity or Material supply issues to secure on time delivery. Work with OSATs and QA to address assembly related quality or customer RMA issues. Work with Procurement, SCM, and Package Development to define Renesas OSAT strategy. Do the industry benchmarking on substrate suppliers, material suppliers, equipment suppliers, and competitors. Do the literature survey and perform competitive analysis. Address PCN and PDN issues. Publish Weekly Assembly Engineering Statistics. Define action plans for yield improvement, cost reduction, cycle time reduction, and continuous improvement. Requirements: 15+ year Assembly Engineering experience MS or Ph.D. degree, Material Science or Mechanical Engineering Excellent communication, documentation, and schedule management skills Solid OSAT management experience Automotive Packaging experience Assembly experience on various packages. FCCSP, FCQFN, FCBGA, QFN, QFP, WLCSP, SiP, Module, and 2.5D. Package substrates experience on MSAP, ETS, Tenting, and ABF substrates. SMT process, Warpage, and Board Level Reliability testing experience Familiar with Industry standards. JEDEC, IPC, Automotive quals, and others Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier . With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future. At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives. We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process. Are you ready to join our team and shape the future with us? Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement .

Responsibilities

• Responsibilities: Responsible for Japan Assembly Engineering (PAE1) and Malysia Assembly Engineering (PAE3) Groups.
• Work with Package Development Group (NPI).
• Takeover qualified products from NPI for mass production.
• Work with Supply Chain Management (SCM).
• Address Capacity or Material supply issues to secure on time delivery.
• Work with OSATs and QA to address assembly related quality or customer RMA issues.

Requirements / Eligibility

• : 15+ year Assembly Engineering experience MS or Ph.D.
• degree, Material Science or Mechanical Engineering Excellent communication, documentation, and schedule management skills Solid OSAT management experience Automotive Packaging experience Assembly experience on various packages.
• FCCSP, FCQFN, FCBGA, QFN, QFP, WLCSP, SiP, Module, and 2.5D.
• Package substrates experience on MSAP, ETS, Tenting, and ABF substrates.
• SMT process, Warpage, and Board Level Reliability testing experience Familiar with Industry standards.

How To Apply

Use the Apply now button and follow the instructions on the application page.