Director, Assembly Operations

Short Summary

Director, Assembly Operations with Renesas Electronics. We are seeking an experienced and strategic Director of Semiconductor IC Packaging Assembly Operations to lead high-volume semiconductor assembly operations for advanced packaging technologies. This role is accountable for converting qualified package technologies and NPI programs into predictable, scalable manufacturing execution that achieves production output…

Key Details

• Position / opportunity: Director, Assembly Operations
• Organization: Renesas Electronics
• Country / coverage: Malaysia
• Location: Shah Alam, Selangor, Malaysia
• Work arrangement: On-site
• Opportunity type: Tenders / Consultancies
• Sector: Information Technology
• Compensation: Not specified
• Duration: Not specified
• Start date: 2026-07-22
• Application deadline: Not specified

Description

We are seeking an experienced and strategic Director of Semiconductor IC Packaging Assembly Operations to lead high-volume semiconductor assembly operations for advanced packaging technologies. This role is accountable for converting qualified package technologies and NPI programs into predictable, scalable manufacturing execution that achieves production output, customer commit dates, and revenue targets. The scope includes AI/data center infrastructure power packaging applications, especially Smart Power Stages, Vertical Power Stages, Power Modules, and Discrete FET packages, with additional scope spanning wide-bandgap (WBG) technologies including SiC and GaN, DBC and AMB substrates, and advanced interconnect technologies. This leader will oversee assembly line readiness, manufacturing execution, capacity utilization, cycle time, yield performance, quality control, process change management, and ramp readiness while partnering closely with Package Engineering, Product Engineering, Quality, Supply Chain Management, Planning, Procurement, and external OSAT partners. The ideal candidate combines deep semiconductor assembly operations expertise with strong manufacturing leadership, data-driven execution, and cross-functional collaboration skills to drive factory performance, product quality, delivery reliability, and continuous improvement across global operations. This role also serves as a critical interface to Package Engineering and Supply Chain Management by ensuring package development intent, qualification requirements, equipment capacity plans, material readiness, bill of material readiness, and production ramp requirements are translated into stable, cost-competitive, high-volume assembly output. Key Responsibilities: Semiconductor Assembly Operations Leadership Lead semiconductor package assembly operations across global product lines and manufacturing partners. Drive daily, weekly, and quarterly execution to achieve production output, customer delivery commitments, and revenue targets. Manage assembly capacity, throughput, cycle time, yield, labor utilization, equipment utilization, and operational cost performance. Establish operating mechanisms for production reviews, bottleneck resolution, escalation management, and factory performance tracking. Partner with Package Engineering, Product Engineering, Quality, Supply Chain Management, Planning, Procurement, and OSAT teams to ensure manufacturable designs, qualified processes, and robust production controls. Production Output, Yield & Continuous Improvement Own assembly output performance, yield monitoring, trend analysis, and corrective action processes. Lead data-driven improvement initiatives to increase line output, reduce bottlenecks, improve first-pass yield, and shorten cycle time. Resolve process, equipment, material, reliability, and customer quality issues through disciplined root-cause analysis. Define KPIs and dashboards to track production output, revenue-supporting shipments, manufacturing performance, and operational effectiveness. Quality & Reliability Management Partner with Quality and Reliability teams to meet internal, industry, and customer standards. Drive containment, corrective, and preventive actions for manufacturing and field quality issues. Ensure process controls and qualification requirements are maintained across OSAT sites. Support customer, supplier, and internal quality audits and reviews. Work with manufacturing partners to resolve issues early and ensure shipment of qualified products. Process Change Management Lead process change management for materials, equipment, tooling, flows, and sites. Assess engineering changes for technical, quality, reliability, supply, and operational impact. Lead qualification plans for transfers, second sourcing, equipment changes, and cost reductions. Maintain disciplined documentation, change control, and manufacturing readiness processes. NPI Ramp Readiness & High-Volume Manufacturing Execution Serve as the key assembly operations interface for NPI-to-production transfers and high-volume ramp execution. Partner with Supply Chain Management, Planning, Procurement, Package Engineering, Product…

Responsibilities

• We are seeking an experienced and strategic Director of Semiconductor IC Packaging Assembly Operations to lead high-volume semiconductor assembly operations for advanced packaging technologies.
• This role is accountable for converting qualified package technologies and NPI programs into predictable, scalable manufacturing execution that achieves production output, customer commit dates, and revenue targets.
• The scope includes AI/data center infrastructure power packaging applications, especially Smart Power Stages, Vertical Power Stages, Power Modules, and Discrete FET packages, with additional scope spanning wide-bandgap (WBG) technologies including SiC and…
• This leader will oversee assembly line readiness, manufacturing execution, capacity utilization, cycle time, yield performance, quality control, process change management, and ramp readiness while partnering closely with Package Engineering, Product…
• The ideal candidate combines deep semiconductor assembly operations expertise with strong manufacturing leadership, data-driven execution, and cross-functional collaboration skills to drive factory performance, product quality, delivery reliability, and…
• This role also serves as a critical interface to Package Engineering and Supply Chain Management by ensuring package development intent, qualification requirements, equipment capacity plans, material readiness, bill of material readiness, and production…

Requirements / Eligibility

• requirements, equipment capacity plans, material readiness, bill of material readiness, and production ramp requirements are translated into stable, cost-competitive, high-volume assembly output.
• Key Responsibilities: Semiconductor Assembly Operations Leadership Lead semiconductor package assembly operations across global product lines and manufacturing partners.
• Drive daily, weekly, and quarterly execution to achieve production output, customer delivery commitments, and revenue targets.
• Manage assembly capacity, throughput, cycle time, yield, labor utilization, equipment utilization, and operational cost performance.
• Establish operating mechanisms for production reviews, bottleneck resolution, escalation management, and factory performance tracking.

How To Apply

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